Copper EM-Tec FIB lift out grids
The copper EM-Tec FIB lift-out grids are available with either 2, 3, 4 or 5 posts. Thickness is 30-40µm, which makes them more rigid then standard TEM grids. EM-Tec FIB lift-out grids undergo a unique cleaning process to reduce contamination; this results in improved mounting and imaging of the TEM lamellas. Due to the manufacturing process, the copper FIB lift-out grids have a set-back ridge at the edge of the front side and exhibit smooth side walls. Packaging size is vial/100.
|2 post FIB lift-out grid||3 post FIB lift-out grid||4 post FIB lift-out grid||5 post FIB lift-out grid|
|post size 250×200µm||post sizes 125×200 & 80×200µm||post size 80×200µm||post size 70×190µm|
|attach single lamellas||attach multiple TEM lamellas||attach many TEM lamellas||attach many TEM lamellas|