Description
The molybdenum EM-Tec FIB lift-out grids are sturdier than the copper grids, they are also used where copper would interfere with investigation of the TEM lamella. The thickness of the standard Mo FIB lift-out grids is 45-55µm. Available with 2, 3 and 4 posts. Due to the material and the manufacturing proces, the side walls of the Mo FIB lift-out grids are rougher than the those of the Cu FIB lift-out grids. Use of the FIB is therefore needed to make the sidewalls smoother. Packaging size is vial/25.
| 2 post FIB lift-out grid | 3 post FIB lift-out grid | 4 post FIB lift-out grid |
| post size 250×200µm | post sizes 125×200& 80×200µum | post size 80×200µm |
| use for attaching single lamellas per post | use for attaching multiple TEM lamellas | use for attaching many TEM lamellas |
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