Description
Copper EM-Tec FIB lift out grids
The copper EM-Tec FIB lift-out grids are available with either 2, 3, 4 or 5 posts. Thickness is 30-40µm, which makes them more rigid then standard TEM grids. EM-Tec FIB lift-out grids undergo a unique cleaning process to reduce contamination; this results in improved mounting and imaging of the TEM lamellas. Due to the manufacturing process, the copper FIB lift-out grids have a set-back ridge at the edge of the front side and exhibit smooth side walls. Packaging size is vial/100.
| 2 post FIB lift-out grid | 3 post FIB lift-out grid | 4 post FIB lift-out grid | 5 post FIB lift-out grid |
| post size 250×200µm | post sizes 125×200 & 80×200µm | post size 80×200µm | post size 70×190µm |
| attach single lamellas | attach multiple TEM lamellas | attach many TEM lamellas | attach many TEM lamellas |
